Removing PFAS from Semiconductor Manufacturing

  • News: EU 'off the pace' in global microchip race: Auditors
  • Launches: OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
  • Charts: Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
  • Research: Removing PFAS from Semiconductor Manufacturing
  • Insight: Cadence to Buy Artisan to Support Chiplet, 3D IC Future

News

EU ‘off the pace’ in global microchip race: Auditors
The EU is falling short of its target to capture 20% of the global microchip market by 2030, according to auditors. Despite the passing of the Chips Act in 2023, investments from competitors like the US and China are outpacing EU efforts. The report emphasizes the need for a reality check and a reassessment of the EU’s strategy to effectively compete in the fast-evolving semiconductor landscape.

EU Microchip Race


Launches

OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has announced the development of 124-layer PCB technology designed for high-bandwidth memory used in AI semiconductors, marking a significant leap in the number of layers over conventional designs. This technology aims to meet the increasing demands of AI processing and is set for mass production by October 2025.

124-Layer PCB


Charts

Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The advanced semiconductor packaging market is projected to grow significantly, reaching USD 29.8 billion by 2031, driven by the demand for heterogeneous chiplet architectures and advancements in automotive and telecommunications. This growth underscores the shift in value creation from front-end scaling to back-end integration.

Advanced Packaging Growth Chart


Research

Removing PFAS from Semiconductor Manufacturing
Imec is spearheading efforts to eliminate PFAS from semiconductor manufacturing processes amid growing regulatory scrutiny. The initiative focuses on developing PFAS-free materials for photolithography and other processes, aiming for a sustainable transition while maintaining performance standards.

PFAS Elimination


Insight

Cadence to Buy Artisan to Support Chiplet, 3D IC Future
Cadence Design Systems has announced plans to acquire Arm’s Artisan IP business to enhance its offerings in chiplet and 3D IC design. This acquisition is part of Cadence’s strategy to address the evolving demands of AI workloads and multi-die integration, showcasing the industry’s shift towards modular chip designs.

Cadence Acquisition


Stay informed with the latest advancements and trends in the semiconductor industry. For more insights and detailed articles, explore our website!

© 2025 opensemi All Rights Reserved. 本站访客数人次 本站总访问量
Theme by MegaBolD