News
Cyber Threats Multiply With Commercial Chiplets
The proliferation of chiplets in semiconductor designs is increasing the potential for hardware attacks, necessitating enhanced security measures throughout the supply chain. As more chiplets are integrated, the number of attack vectors rises, prompting a call for comprehensive security protocols that ensure device integrity from design to end-of-life.
Launches
Alpha and Omega Semiconductor Enables 48V Hot Swap in AI Servers with New High SOA MOSFET
AOS has introduced the AOTL66935 MOSFET, designed to meet 48V hot swap requirements in AI server applications. This new device combines low on-resistance with high safe operating area (SOA) capabilities, enhancing performance and reliability in demanding environments.
Charts
Advanced Semiconductor Packaging Market Forecast
The advanced semiconductor packaging market is projected to grow at a CAGR of 7.5%, reaching $29.8 billion by 2031. This growth is driven by rising demand for heterogeneous chiplet architectures and high-bandwidth memory solutions, particularly in automotive, telecommunications, and AI applications.
Research
Passivation Technique Reduces Defects in Kesterite Solar Cells
Researchers have developed a new passivation technique that improves the efficiency of kesterite solar cells to 11.51%. This breakthrough addresses atomic-scale defects that previously hindered performance, paving the way for more efficient and eco-friendly solar energy solutions.
Insight
Automotive Functional Safety Challenges
As vehicles evolve into complex systems with numerous chips, ensuring functional safety (FuSa) is critical. This article discusses the importance of standards like ISO 26262 and the integration of security from the design phase to maintain the safety and reliability of modern vehicles.
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