Aperture MEMS Modulator Paves Way for High-Speed Energy-Efficient Optical Communication Systems

  • News: Aperture MEMS Modulator Paves Way for High-Speed Energy-Efficient Optical Communication Systems
  • Launches: Semikron Danfoss Celebrates its First GAINS Registered Apprenticeship Graduates
  • Charts: TECHCET Projects Big Development for Lithography Materials
  • Research: Smart, Stretchable and Sustainable: The Future of DLP-Printed Flexible Devices
  • Insight: Navigating Thermal Challenges in Advanced Systems on Chip

News

Aperture MEMS Modulator Paves Way for High-Speed Energy-Efficient Optical Communication Systems
A new MEMS grating modulator developed at Northwestern Polytechnical University achieves 90% optical efficiency and supports modulation speeds up to 250 kHz. With a large aperture of 30 × 30 mm, this device is set to enhance free-space optical communication and remote sensing applications, addressing key challenges in modulation speed and energy efficiency.

MEMS Modulator


Launches

Semikron Danfoss Celebrates its First GAINS Registered Apprenticeship Graduates
Semikron Danfoss has graduated its first cohort of 15 apprentices from the Industrial Manufacturing Technician RA program, coinciding with the U.S. Department of Labor’s National Apprenticeship Day. This program aims to address workforce needs in New York’s semiconductor industry, emphasizing the importance of skilled labor for future manufacturing advancements.

Graduation Celebration


Charts

TECHCET Projects Big Development for Lithography Materials
TECHCET forecasts a 7% increase in photolithography materials revenue in 2025, driven by strong demand for advanced photoresists, particularly EUV. This growth is indicative of a recovery in the semiconductor market, with projections for continued expansion through 2029.

Lithography Materials Chart


Research

Smart, Stretchable and Sustainable: The Future of DLP-Printed Flexible Devices
Research from the University of Macau and Hong Kong University emphasizes the role of digital light processing (DLP) 3D printing in creating advanced flexible devices. This method promises to revolutionize applications in health monitoring and robotics by enabling the fabrication of complex, high-performance structures with sustainable materials.

DLP-Printed Devices


Insight

Navigating Thermal Challenges in Advanced Systems on Chip
Imec discusses the growing thermal challenges in system-on-chip (SoC) designs, emphasizing the need for new simulation frameworks and architectures to manage heat dissipation effectively. As power densities increase, integrating thermal management into design processes becomes crucial to maintaining performance and reliability.

Thermal Management in SoCs


Stay tuned for more updates and insights into the semiconductor industry’s latest innovations and trends!

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