Hardware Security Tech Can Hide and Reveal Encryption Keys on Demand

  • News: AI Clusters Spur Optical Connectivity
  • Launches: nm Alliance Targeting 2027 Production
  • Charts: Arm: Chiplets Can’t Deliver on TCO Without an Ecosystem
  • Research: Hardware Security Tech Can Hide and Reveal Encryption Keys on Demand
  • Insight: CEO Interview with Yannick Bedin of Eumetrys

News

AI Clusters Spur Optical Connectivity
Broadcom has announced its third-generation 200G/lane co-packaged optics (CPO) product line, aimed at supporting the growing optical bandwidth requirements driven by AI workloads. With advancements in laser technology, Broadcom is integrating optical components into higher-density siliconized devices to enhance performance and reduce power consumption, responding to the demands of AI clusters and data centers.

AI Clusters


Launches

nm Alliance Targeting 2027 Production
Rapidus has formed an alliance with Siemens to achieve 2-nm wafer production by 2027. This partnership aims to leverage IBM’s technology and create a reference flow for design verification and manufacturing, enhancing Japan’s semiconductor capabilities and reducing reliance on China.

Rapidus and Siemens


Charts

Arm: Chiplets Can’t Deliver on TCO Without an Ecosystem
Arm emphasizes the need for a robust ecosystem and standards in the chiplet marketplace to ensure economic viability. The current semi-custom chiplet designs can inflate overall costs, and a true marketplace approach is essential for maximizing total cost of ownership (TCO) and promoting chiplet reuse.

Chiplet Ecosystem


Research

Hardware Security Tech Can Hide and Reveal Encryption Keys on Demand
Researchers at Seoul National University have developed a new hardware security technology using 3D NAND flash memory that can conceal security keys until needed. This innovation enhances data security without requiring changes to existing memory structures, making it applicable for various devices, including smartphones and IoT.

Hardware Security


Insight

CEO Interview with Yannick Bedin of Eumetrys
Yannick Bedin discusses EUMETRYS’s role in semiconductor manufacturing, focusing on quality control and inspection solutions that combat the $10-20 billion annual losses due to defective silicon wafers. He emphasizes the importance of a one-stop-shop approach to streamline processes and enhance manufacturing efficiency.

Yannick Bedin


Stay tuned for more updates as we continue to explore the latest advancements in the semiconductor industry!

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