News
Jaclyn Kellon, PhD Joins SIA Team
The Semiconductor Industry Association (SIA) has appointed Jaclyn Kellon as a director focusing on global policy, particularly in supply chain security and cybersecurity. Her experience at the U.S. Department of State and the National Nanotechnology Coordination Office will bolster SIA’s efforts in navigating complex global semiconductor challenges.
Launches
Teledyne HiRel Semiconductors Announces High-Density 16 GByte DDR4 Module
Teledyne HiRel has launched the TDD416Y12NEPBM01, a compact DDR4 memory module designed for high-speed applications in constrained spaces. This innovation promises significant power savings and enhanced performance, making it ideal for modern embedded platforms.
Charts
Key Innovations in Integrated Photonic Chips
Recent advancements in monolithically integrating indium arsenide quantum dot lasers on silicon photonic chiplets signify a step forward for data communications. This chart visualizes the potential impact of these innovations on the photonics landscape, highlighting the scalability and efficiency of integrated systems.
Research
Charge Density Wave Materials May Speed Up Electronics
Researchers have discovered a new phase of tantalum disulfide that could revolutionize electronics by enabling faster data processing and in-memory computing. This research opens the door to more energy-efficient electronic devices, potentially reshaping the semiconductor landscape.
Insight
Chiplet Ecosystem Slowly Emerges
Industry experts discuss the progress and challenges surrounding chiplet design, emphasizing the importance of a collaborative ecosystem. The discussion highlights how chiplets can enhance flexibility and efficiency while addressing the complexities of integration.
Thank you for staying tuned for the latest updates in the semiconductor industry. We look forward to bringing you more insights and developments in the coming weeks!