Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years

  • News: Lam Research Receives 2025 SEMI Award for North America
  • Launches: Advanced Packaging Fuels Growth in the Semiconductor Back-End
  • Charts: Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
  • Research: Global Efficiency Record Set for Large, Triple-Junction Perovskite Solar Cell
  • Insight: How 3D-IC Will Change Chip Design

News

Lam Research Receives 2025 SEMI Award for North America
Lam Research Corp. has been awarded the 2025 SEMI Award for North America for its innovative cryogenic etch technology, pivotal in advancing 3D NAND device manufacturing essential for AI applications. The award was presented during SEMICON® West, highlighting the company’s contributions to high-capacity memory solutions amidst soaring demand driven by generative AI.

Lam Research Award


Launches

Advanced Packaging Fuels Growth in the Semiconductor Back-End
The semiconductor back-end equipment market is forecasted to grow significantly, driven by advancements in packaging technologies. Innovative solutions like Thermo Compression Bonding (TCB) and hybrid bonding are transforming the landscape, catering to the demands of AI, HPC, and automotive applications, with the market expected to reach $9.8 billion by 2030.

Advanced Packaging


Charts

Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
SEMI’s latest report indicates that global spending on 300mm fab equipment will exceed $374 billion between 2026 and 2028, with significant investments driven by AI chip demand and regional self-sufficiency initiatives. The report highlights a projected increase in spending, particularly in memory and logic segments.

300mm Fab Equipment Spending


Research

Global Efficiency Record Set for Large, Triple-Junction Perovskite Solar Cell
A research team led by the University of Sydney has achieved a record 23.3% efficiency for a large-area triple-junction perovskite solar cell. This advancement is pivotal for the development of efficient solar technologies, moving closer to practical applications in energy generation and sustainability.

Triple-Junction Solar Cell


Insight

How 3D-IC Will Change Chip Design
Experts discuss the significant challenges and opportunities presented by 3D-IC design. The transition from traditional 2D designs to 3D stacking introduces complexities in verification, integration, and performance, necessitating new methodologies and collaborative approaches among chip designers.

3D-IC Design


Stay tuned for more updates as we continue to bring you the latest news and insights from the semiconductor industry.

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