L&T Semiconductor and Hon Young Partner for High-Voltage SiC Wafer Development

  • News: Lam Research Tackles Engineer Shortage with Virtual Process Integration
  • Launches: L&T Semiconductor and Hon Young Partner for High-Voltage SiC Wafer Development
  • Charts: Power SiC Market Poised for Significant Growth by 2029
  • Research: Blueprint for Stretchable Synaptic Transistors Unveiled
  • Insight: Physical AI and Robotics Demand a Robust Ecosystem for Future Growth

News

Lam Research Tackles Engineer Shortage with Virtual Process Integration
Lam Research is addressing the U.S. semiconductor engineer shortage by providing its SEMulator3D® modeling platform to educational institutions. This platform offers students virtual, hands-on experience in chip manufacturing, bridging the gap between theoretical knowledge and practical fab experience. It enables students to design, analyze, and optimize fabrication steps without physical wafers.

  • SEMulator3D uses physics-based simulation to replicate fabrication processes like etch, deposition, and lithography.
  • It helps students understand the “why” behind process integration, fostering critical decision-making skills.
  • The platform runs on student laptops, ensuring accessibility for future semiconductor professionals globally.

Launches

L&T Semiconductor and Hon Young Partner for High-Voltage SiC Wafer Development
L&T Semiconductor Technologies Ltd (LTSCT) has partnered with Hon Young Semiconductor (HYS) to develop high-voltage silicon carbide (SiC) wafers ranging from 650V to 3300V. This collaboration targets the growing demand for SiC devices in electric vehicles (EVs), renewable energy systems, and industrial applications, aiming to enhance energy efficiency through superior thermal performance and lower switching losses.

Power Modules

  • The partnership focuses on SiC wafers for power devices like SiC MOSFETs and Schottky barrier diodes.
  • SiC devices are critical for improving efficiency in EV chargers, solar inverters, and motor drives.
  • This collaboration seeks to ensure a stable supply and competitive pricing for global customers, fostering innovation and IP creation.

Charts

Power SiC Market Poised for Significant Growth by 2029
A recent analysis by Yole Group highlights the robust growth trajectory of the power SiC market, projecting it to exceed $11 billion by 2029. This substantial expansion is primarily fueled by increasing adoption in electric vehicles (EVs) and the broader energy transition. The report underscores the critical role of SiC technology in achieving higher efficiency and performance across various power electronics applications.

Power SiC Market Forecast

  • The market growth is driven by rising demand for SiC in EV main inverters and industrial applications.
  • SiC penetration is expanding across automotive, industrial, and energy sectors due to efficiency benefits.
  • Forecasts indicate continued high growth rates, solidifying SiC’s position as a key enabling technology.

Research

Blueprint for Stretchable Synaptic Transistors Unveiled
Researchers from Seoul National University have developed a comprehensive manufacturing “blueprint” for stretchable synaptic transistors, crucial for soft electronics. The review details how material selection, process flow (photopatterning, printing, lamination), and device architecture collectively determine the electro-mechanical stability and learning accuracy of these flexible devices, even under significant tensile strain.

  • Key findings emphasize the importance of device architecture, with vertical organic transistors outperforming planar channels under deformation.
  • The insights advance soft neuromorphic hardware towards scalable, CMOS-compatible integration for on-skin wearables and bio-interactive prosthetics.
  • Challenges remain, including the need for ambipolar stretchable semiconductors and robust interfacial insulation for vertical stacking.

Insight

Physical AI and Robotics Demand a Robust Ecosystem for Future Growth
Industry experts, including Anders Billesø Beck from Universal Robots and Paul Williamson from Arm, highlight the critical need for a comprehensive technology ecosystem to drive the success of “physical AI” or “embodied AI” in robotics. While humanoid robots capture imagination, the immediate focus is on collaborative robots (cobots) for industrial automation, addressing complex, variable tasks that benefit immensely from AI-driven flexibility and software updates.

Universal Robots Cobot

  • AI enables cobots to handle high variability in tasks, accelerating automation in logistics and assembly.
  • Functional safety for AI-powered robotics is a significant challenge requiring innovation from silicon to ecosystem levels.
  • A strong partner ecosystem, including hardware peripherals and software plugins, is essential for integration and scaling AI deployments in robotics.

Stay tuned for more updates as the semiconductor industry continues to push the boundaries of innovation and shapes the future of technology.

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