News
Europe’s Chips Act 2.0: A Blueprint for Distributed AI and Sovereign Computing
The European Union is strategically pivoting its technological agenda with “Chips Act 2.0,” shifting its focus from mere factory commitments to securing the “Next Computing Paradigm” (NCP). This move, anchored in the HiPEAC Vision 2025, emphasizes distributed intelligence for AI and leveraging Europe’s strengths in edge and cyber-physical systems, aiming to counteract a significant “capital drain” to the U.S.
- The second phase of the Chips Act aims to support the entire supply chain, including design firms and equipment manufacturers, beyond just “First-of-a-Kind” facilities.
- Despite ambitious targets, SEMI Europe members express skepticism about achieving 20% global market share by 2030, advocating for harmonized tax credits for R&D and CAPEX to bolster SMEs.
- The strategy underscores the importance of mastering design and toolchain ecosystems, promoting technologies like chiplets and open-source hardware (e.g., RISC-V) to reduce dependency on external manufacturers.
Launches
Q.ANT Debuts Second-Gen TFLN Photonic Chip for Advanced AI Acceleration
Photonic chip startup Q.ANT has announced a successful Series A funding round, totaling $80 million, alongside the unveiling of its second-generation photonic chip, the Q.ANT NPU 2. This thin-film lithium niobate (TFLN)-based chip is engineered for complex neural network architectures beyond large language models, targeting image, audio, and video processing. The NPU 2 boasts enhanced performance with 8 GOPS and a 2 GHz clock speed, operating at approximately 150W.
- The TFLN process harnesses non-linear optical properties for energy-efficient execution of non-linear mathematics, addressing performance and energy consumption challenges faced by CMOS technology.
- A new four-year collaboration with the Jülich Supercomputing Centre will explore practical applications and integration of photonic computing with traditional computing systems.
- Q.ANT’s proprietary software stack facilitates on-chip training and includes a “model zoo” featuring algorithms optimized to leverage the NPU’s core capabilities.
Charts
Tokyo Electron Completes New Tohoku Production and Logistics Hub Amidst Market Expansion
Tokyo Electron (TEL) has completed its Tohoku Production and Logistics Center in Oshu City, Iwate Prefecture, marking a significant investment of approximately 24 billion yen. This new 58,000 m² hybrid facility strategically consolidates production and warehouse functions, aiming to reduce lead times, enhance operational efficiency, and improve flexibility in response to the anticipated growth in demand for deposition systems driven by global digitalization and decarbonization trends.
- The center will implement advanced automation, including multifunctional robots for warehousing and an integrated production line, to streamline workflows and drastically cut lead times.
- Designed with sustainability in mind, the facility integrates energy-efficient equipment and consolidates logistics to minimize truck travel distances, consequently reducing CO2 emissions.
- This strategic expansion underscores TEL’s commitment to ensuring timely product delivery and fostering sustainable corporate growth in line with evolving semiconductor technology demands.
Research
Memsstar Unveils Breakthrough Vacuum Vapour-Phase Metal-Assisted Chemical Etching (MacEtch)
Memsstar Ltd., in partnership with the Paul Scherrer Institute (PSI) and Fraunhofer ENAS, has introduced a groundbreaking vacuum vapour-phase Metal-assisted Chemical Etching (MacEtch) technology. This innovative, plasma-free silicon etch process offers highly controlled, anisotropic etching for developing next-generation micro- and nanoscale architectures, demonstrating significantly reduced porosity, improved uniformity, and exceptional suitability for extremely high aspect ratio nanostructures.
- Implemented on memsstar’s ORBIS platform, the technology allows for precise gas-phase control and in-process endpoint detection, enabling sharply defined silicon profiles.
- Early results confirm uniform etch profiles across 4-inch wafers and the creation of nanowire structures as fine as 100 nm with aspect ratios surpassing 430:1.
- The vapor-phase module can be integrated with other memsstar process technologies, such as thermal pre-treatment and self-assembled monolayer (SAM) coating, offering versatile manufacturing solutions for diverse applications from MEMS to advanced semiconductor packaging.
Insight
Mastiska CEO Champions Sovereign AI Silicon in the UAE with $10M Seed Funding
Suresh Sugumar, CEO of UAE-based Mastiṣka, offers key insights into the company’s strategic vision following a $10 million seed funding round from GCC sovereign wealth funds. Sugumar emphasizes that “Sovereign AI starts with sovereign silicon,” positioning Mastiṣka in a “blue ocean” market to develop data-center class inference accelerators, aiming to create a UAE-based fabless semiconductor entity leveraging open-source technologies.
- Mastiṣka’s initial market offerings will be custom FPGA cards, augmented with increased HBM, designed as commercially viable, lower-performance alternatives for AI inference tasks.
- The company’s long-term roadmap includes taping out a RISC-V-based, neuromorphic-inspired ASIC within the next few years, integrating open-source frameworks and innovative brain-inspired models.
- Sugumar highlights the commitment to providing sovereign customers with full audit access for cybersecurity and fostering local talent through establishing offices in partner GCC countries.
Stay connected with us for the most pivotal updates and strategic shifts shaping the semiconductor industry’s exciting future.